Machine designed to grind and/or polishinjg the main surface of the tiles and slabs. Grinding machine available in dry or wet mode. Polishing machine available in wet mode only.

• Operating thickness range: 14 ÷ 130 mm
• Strong lower frame with anti-wear steel plates to reduce consumption due to belt slip
• Upper bridge engineered to reduce heads vibrations and noise, increasing the calibrating efficiency
• Heads could be equipped with diamonds tools, grinding-stones and Frankfurt abrasive as well
• Tools cooled with water flowing in the centre of the spindle (for wet machine only)
• Water feeding system for a dedicated and optimum cooling of the diamonds with centrifugal distribution (for wet machine only)
• Lateral side guides for tiles manually adjustable
• Safety covers for the heads access crash proof, oxidation proof and ergonomically shaped
• Doors (patented) ensure clean and efficient tools change
• Steel structures multi-layer painted to avoid corrosion and rust
• Machine controlled by Siemens S7 PLC and Siemens touch screen panel
• TE.SE.O. (Tele service OCEM) to connect the machine with our after sale service in real time